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| APX9132 Hall Effect Micro Switch IC Features * * * * * Micro Power Operation for Battery Applications Chopper Stabilized Amplifier Independent of North or South Pole Magnet, Easy for Manufacture Small Size Package Lead Free Available (RoHS Compliant) General Description The APX9132 integrated circ uit is an ultra-sensit ive, pole independent Hall-effect switch with a latched digital output . A 2.5 volt t o 3.5 volt operation and a unique clocking scheme reduce the average operating power requirements, Either a north or sout h pole of sufficient flux will turn the output on; in the absence of a magnetic field, t he out put is off. The polarit y independence and minimal power requirement allow t his devic e t o be easily replac ed reed swit c h for s uperior for s ignal c ondit ioning. A dvanc ed CMOS proc es s ing is used to take advantage of low-voltage and low-power requirements, SOT-23 package provided a optimized package for most applications. Applications * * * * Micro Switch Handheld Wireless Application Wake Up Switch Clamp Shell Type Application Switch Magnet Switch in Low Duty Cycle Applications Pin Description GND APX9132 VDD VOUT Ordering Information APX9132 Lead Free Code Handling Code Temp. Range Package Code SOT-23 Package Code A : SOT-23 AT : SOT-23 Thin Temp. Range I : -40 to 85 C Handling Code TR : Tape & Reel Lead Free Code L : Lead Free Device Blank : Original Device X: Date Code APX9132 A/AT: X32X No tes : ANPEC lea d-free p rod ucts contai n m old ing co mp oun ds/die attach materi als and 100 % m atte in pla te te rmin atio n fi nish ; wh ich are full y compl iant with Ro HS and compa tibl e wi th both SnPb an d le ad-free sold ieri ng op era tio ns. AN PEC le ad-free produ cts me et or exceed th e l ead -free req uireme nts of IPC /JEDEC J STD -02 0C fo r MSL classi ficati on at lea d-fre e p eak re flo w temp era ture. ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders. C opyright (c) ANPEC Electronics C orp. Rev. A.1 - Nov., 2005 1 www.anpec.com.tw APX9132 Function Pin Descriptions No 1 2 3 Name VDD VOUT GND Function Power Input When a magnetic field enters the hall element and exceeds the OPS (or less than B OPN ) the output turns on (output is operate point B low). When the magnetic field is below the release point BRPS (or above BRPN ), the output turns off (output is high). Ground Connection Block Diagram VDD Awake & Sleep Timing Logic Hall Plane Dynamic Offset Cancellation Latch Circuit VOUT Chopper Amplifier Hysteresis Control GND Typical Applications VOUT VDD + 2.5V-3.5V 0.1uF APX9132 GND - SOT-23 (Top View) C opyright (c) ANPEC Electronics C orp. Rev. A.1 - Nov., 2005 2 www.anpec.com.tw APX9132 Absolute Maximum Ratings Symbol VDD VOUT IOUT TJ TSTG Supply Voltage Output Voltage Output Current Junction Temperature Range Storage Temperature Range Parameter TA = 25C unless otherwise noted Rating 5 5 1 150 -65 to +150 Unit V V mA C Electrical Characteristics Symbol VDD IDD IOFF VOH VOL tawake tperiod d.c. fc Characteristic Supply Voltage Range Supply Current TA = 25C, VDD=3V unless otherwise noted Test Condition Operating Average Awake Sleep VOUT=3.5V, B RPN Unit V A mA A A V mV s mS % KHz Output Leakage Current Output High Voltage Output Low Voltage Wake up Time Period Duty Cycle Chopping Frequency Magnetic Characteristics Symbol BOPS BOPN BRPS BRPN Bhys Characteristic Operate Points TA = 25C, VDD=3V unless otherwise noted Test Condition APX9132 Min. -45 10 Typ. 30 -30 20 -20 10 -10 Max. 45 Unit G G G G G Release Points Hysteresis C opyright (c) ANPEC Electronics C orp. Rev. A.1 - Nov., 2005 3 www.anpec.com.tw APX9132 Typical Characteristics Switching Points vs. Ambient Temperature 40 30 BOPS Switching Points vs. Supply Voltage 40 BOPS TA=25X C 30 Switching Points (G) Switching Points (G) 20 10 0 -10 -20 -30 -40 -40 BOPN BRPN BRPS 20 10 0 -10 -20 -30 -40 BOPN BRPN BRPS -20 0 20 40 60 80 100 2.5 3 3.5 4 4.5 5 Ambient Temperature (C) Supply Voltage (V) Average Supply Current vs. Ambient Temperature 10 Average Supply Current vs.Supply Voltage 20 TA=25X C Average Supply Current (uA) 8 Average Supply Current (uA) 18 16 14 12 10 8 6 4 2 0 2.5 3 3.5 4 6 4 2 0 -40 -20 0 20 40 60 80 100 4.5 5 Ambient Temperature (C) Supply Voltage (V) C opyright (c) ANPEC Electronics C orp. Rev. A.1 - Nov., 2005 4 www.anpec.com.tw APX9132 Typical Characteristics Output Source Current vs. Output Voltage 5 Output Sink Current vs. Output Voltage 10 9 Output Source Current (mA) Output Sink Current (mA) 4 Vcc=5V 8 7 6 5 4 3 2 1 0 Vcc=4V Vcc=5V Vcc=3V 3 Vcc=4V 2 Vcc=3V 1 0 0 0.2 0.4 0.6 0.8 1 0 0 0.2 0.4 0.6 0.8 1 Output Voltage (V) Output Voltage (V) Output Switch Waveform Output Switch Waveform Output Sink Voltage (0.5V/div) Vcc=3V CL=12pF Output Sink Voltage (0.5V/div) Vcc=3V CL=12pF Vout (0.5V/div) Vout (0.5V/div) Time (50us/div) Time (50us/div) C opyright (c) ANPEC Electronics C orp. Rev. A.1 - Nov., 2005 5 www.anpec.com.tw APX9132 Function Description Operation The output of APX9132 switches low (turns on) when in pres ence of strong flux density facing the marked side of package exceeds the operate point BOPS (or is less than BOPN). After turn-on, the output is capable of sinking up to 1mA and the output voltage is low (turns on). In absence of flux density below the release point BRPS (or increased above BRPN), the APX9132 output switc hes high (turns off). After turn-off, the output is capable of sourcing up to 1mA and the output voltage is high (turns off). The difference in the magnetic operated and released point is the hysteresis (Bhys) of the device. This built-in hysteresis allows clean switching of the output even in t he pres ence of ext ernal mechanical bouncing vibration and electrical noise. Pole-independent The pole-independent sens ing technique allows for operat ion with either a north or south pole magnet orientat ion, enhancing t he manufacturabilit y of t he device. The stat e-of-the-art technology provides the same output polarity for either pole in presence. Awake & Sleep Internal awake & sleep timing block circuit activates the sensor for 180 us and deac tivates it for t he remainder of the period (60 ms). A short "awake" time allows for stabilizat ion prior t o the sensor sampling and data latching on the falling edge of the timing pulse. While in sleep cycle the output is latched in its previous state. Chopper Stabilized Technique The chopper stabiliz ed technique cancels t he misOUTPUT OFF 5V MAX OUTPUT VOLTAGE BOPN BOPS matching of the hall element, the amplifier offset voltage and temperature sensitive drift by the dynamic offset cancellation and switched capacitor technique. This technique produces devices have an extremely st able Hall output voltage, therefore t he magnet ic switch points are stable. BRPN 0 -B 0 BRPS OUTPUT ON +B MAGNETIC FLUX Application Information It is strongly recommended that an ex ternal bypass capacit or be connect ed (in close to the Hall sensor) bet ween the s upply and ground of the devic e to reduce both external noise and noise generated by the chopper-stabilization technique. This is especially true due to the relatively high impedance of battery supplies. C opyright (c) ANPEC Electronics C orp. Rev. A.1 - Nov., 2005 6 www.anpec.com.tw APX9132 Package Information SOT-23 D B 3 E 1 2 H e A A1 L C Dim A A1 B C D E e H L Millimeters Min. 1.00 0.00 0.35 0.10 2.70 1.40 1.90/2.1 BSC. 2.40 0.37 3.00 0.094 0.015 Max. 1.30 0.10 0.51 0.25 3.10 1.80 Min. 0.039 0.000 0.014 0.004 0.106 0.055 Inches Max. 0.051 0.004 0.020 0.010 0.122 0.071 0.075/0.083 BSC. 0.118 C opyright (c) ANPEC Electronics C orp. Rev. A.1 - Nov., 2005 7 www.anpec.com.tw APX9132 Package Information SOT-23 Thin D b 3 E1 E 1 2 e e1 L1 R A A1 A2 c L Dim A A1 A2 b c D E E1 e e1 L L1 R Millimeters Min. 0.75 0.025 0.75 0.35 0.10 2.80 2.60 1.50 0.95 BSC 1.90 BSC 0.37 0.60 REF 0.10 0 8 0.004 0 0.60 0.014 Max. 0.80 0.05 0.775 0.51 0.20 3.00 3.00 1.70 Min. 0.028 0.001 0.029 0.014 0.004 0.109 0.101 0.059 Inches Max. 0.031 0.002 0.030 0.020 0.008 0.117 0.117 0.066 0.037 BSC 0.074 BSC 0.023 0.0234 REF 8 C opyright (c) ANPEC Electronics C orp. Rev. A.1 - Nov., 2005 8 www.anpec.com.tw APX9132 Physical Specifications Terminal Material Lead Solderability Packaging Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb), 100%Sn Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3. 3000 devices per reel (IR/Convection or VPR Reflow) Reflow Condition TP tp Critical Zone T L to T P Ramp-up TL Temperature tL Tsmax Tsmin Ramp-down ts Preheat 25 t 25 C to Peak Time Classificatin Reflow Profiles Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Average ramp-up rate 3C/second max. 3C/second max. (TL to T P) Preheat 100C 150C - Temperature Min (Tsmin) 150C 200C - Temperature Max (Tsmax) 60-120 seconds 60-180 seconds - Time (min to max) (ts) Time maintained above: 183C 217C - Temperature (TL) 60-150 seconds 60-150 seconds - Time (t L) Peak/Classificatioon Temperature (Tp) See table 1 See table 2 C of actual Time within 5 10-30 seconds 20-40 seconds Peak Temperature (tp) Ramp-down Rate 6C/second max. 6C/second max. C to Peak Temperature 6 minutes max. 8 minutes max. Time 25 Notes: All temperatures refer to topside of the package .Measured on the body surface. C opyright (c) ANPEC Electronics C orp. Rev. A.1 - Nov., 2005 9 www.anpec.com.tw APX9132 Classificatin Reflow Profiles(Cont.) Table 1. SnPb Entectic Process - Package Peak Reflow Temperatures 3 3 Package Thickness Volume mm Volume mm <350 350 <2.5 mm 240 +0/-5 C 225 +0/- 5 C 2.5 mm 225 +0/-5 C 225 +0/- 5 C Table 2. Pb-free Process - Package Classification Reflow Temperatures 3 3 3 Package Thickness Volume mm Volume mm Volume mm <350 350 -2000 >2000 <1.6 mm 260 +0 C * 260 +0 C* 260 +0 C * 1.6 mm - 2.5 mm 260 +0 C * 250 +0 C* 245 +0 C * 2.5 mm 250 +0 C * 245 +0 C* 245 +0 C * *Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature +0 C. For example 260 C+0 C) at the rated MSL level. Reliability test program Test item SOLDERABILITY HOLT PCT TST ESD Latch-Up Method MIL-STD-883D-2003 MIL-STD-883D-1005.7 JESD-22-B, A102 MIL-STD-883D-1011.9 MIL-STD-883D-3015.7 JESD 78 Description C , 5 SEC 245 1000 Hrs Bias @ 125 C 168 Hrs, 100 % RH , 121 C -65 C ~ 150C, 200 Cycles VHBM > 2KV, VMM > 200V 10ms , Itr > 100mA Carrier Tape & Reel Dimensions t P P1 D Po E F W Bo Ao Ko D1 C opyright (c) ANPEC Electronics C orp. Rev. A.1 - Nov., 2005 10 www.anpec.com.tw APX9132 Carrier Tape & Reel Dimensions(Cont.) T2 J C A B T1 Application A 1781 B 60 1.0 D C 12.0 D1 p0.1MIN C 12.0 D1 1.1 0.1 J 2.5 0.15 Po 4.0 J 2.5 0.15 Po 4.0 0.1 T1 9.0 0.5 P1 2.0 0.05 T1 9.0 0.5 P1 2.0 0.05 T2 1.4 Ao 3.1 T2 1.4 Ao 3.30.1 SOT-23 Application F W 8.0+ 0.3 - 0.3 Bo 3.0 W 8.0+ 0.2 Bo 3.20.1 P 4.0 Ko 1.3 P 4.0 0.1 Ko 1.10.1 E 1.75 t 0.2 0.03 E 1.750.1 t 0.250.05 3.5 0.05 1.5 +0.1 A B 1781 60 1.0 SOT-23 Thin D 1.55+ 3.5 0.05 0.05 F (mm) Cover Tape Dimensions Application SOT- 23 SOT- 23 Thin Carrier Width 8 8 Cover Tape Width 5.3 5.3 Devices Per Reel 3000 3000 (mm) Customer Service Anpec Electronics Corp. Head Office : No.6, Dusing 1st Road, SBIP, Hsin-Chu, Taiwan, R.O.C. Tel : 886-3-5642000 Fax : 886-3-5642050 Taipei Branch : 7F, No. 137, Lane 235, Pac Chiao Rd., Hsin Tien City, Taipei Hsien, Taiwan, R. O. C. Tel : 886-2-89191368 Fax : 886-2-89191369 C opyright (c) ANPEC Electronics C orp. Rev. A.1 - Nov., 2005 11 www.anpec.com.tw |
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